Diodes has introduced its first wafer level chip scale packaged Schottky, which it says offers twice the power density for the same pcb footprint as miniature DFN0603 devices.
Available in a X3-WLCUS0603-3 solder pad package, the 30V, 0.2A SDM0230CSP has a typical thermal resistance of 261ºC/W and is suited to high density designs such as smartphones and tablets.
The Schottky has a low maximum forward voltage of 0.5V for a forward current of 0.2A and a typical low leakage current of 1.5mA at a reverse voltage of 30V.
Diodes claims the device utilises 70% less board space and is 25% thinner than industry standard DFN1006 and SOD923 packaged Schottkys.
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